Package for integrated circuit with thermal vias and method...

Details Package for integrated circuit with thermal vias and method... Package for integrated circuit with thermal vias and method...

2005-03-01

2005-03-01

Niebling, John F. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S122000, C438S125000, C438S126000, C438S127000

Reexamination Certificate

active

06861283

ABSTRACT:
A method for enhancing thermal performance of an integrated circuit package attaches a dummy die to the semiconductor die of the integrated circuit. The dummy die is then thermally coupled through external terminals to the conductive layers of a printed circuit board. In one embodiment, the integrated circuit package includes an insulating substrate on which the dummy die is attached. Conductive vias thermally connect conductive terminals provided on one side of the insulating substrate to conductive terminals provided on the other side of the insulating substrate. In one embodiment, the integrated circuit package is provided as a ball grid array (BGA) package. In addition, multiple layers of conductors can be provided in both the insulating substrate of the integrated circuit and in the external printed circuit board.

REFERENCES:
patent: 5815372 (1998-09-01), Gallas
patent: 6191477 (2001-02-01), Hashemi
patent: 6258626 (2001-07-01), Wang et al.
patent: 6265771 (2001-07-01), Ference et al.
patent: 6352879 (2002-03-01), Fukui et al.
patent: 6514792 (2003-02-01), Katchmar
patent: 6545366 (2003-04-01), Michii et al.
patent: 6621169 (2003-09-01), Kikuma et al.
patent: 20020096755 (2002-07-01), Fukui et al.
patent: 20020185744 (2002-12-01), Katagiri et al.
patent: 20030148597 (2003-08-01), Tan et al.

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