1989-05-02
1989-11-14
Hille, Rolf
357 80, H01L 2330, H01L 2314, H01L 2348
Patent
active
048811165
ABSTRACT:
A package for an integrated circuit having conductor patterns which can be connected to an external circuit to connect the integrated circuit to the external circuit. The package includes a dielectric plate which is provided on one end face with a grounding conductor. The conductor patterns are provided on the opposite end face of the dielectric plate. The dielectric plate is provided with conductor poles which are located between the conductor patterns and which extend through the thickness of the dielectric plate to be connected to the grounding conductor.
REFERENCES:
patent: 4262889 (1986-12-01), Yamamoto et al.
patent: 4498122 (1985-02-01), Rainal
patent: 4551746 (1985-11-01), Gilbert et al.
patent: 4560962 (1985-12-01), Barrow
patent: 4673904 (1987-06-01), Landis
176 Microwave Journal, 27, Mar. 1984, No. 3, Dedham, Mass., U.S.A., "New Surface-Mounted Package Breaks from Traditional MIC Packaging", Boo et al.
International Publication No. WO 84/01470, PCT/US83/01516, "Leadless Chip Carrier for Logic Components".
"Surface-Mounted Gas Active Splitter and Attenuator MMIC's Used in a 1-10-GHz Leveling Loop", G. S. Barta et al., IEEE Transactions on Microwave Theory and Techniques, Vo. MTT-34, No. 12, Dec. 1986, pp. 1569-1575.
"Surface-Mount Pack Houses GaAs MMICs", Geoffrey Herrick et al., Microwaves & RF, Jun. 1986, pp. 157-169.
Hidada Norio
Hirachi Yasutake
Clark S. V.
Fujitsu Limited
Hille Rolf
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