Package for housing semiconductor elements

Details Package for housing semiconductor elements Package for housing semiconductor elements

1988-05-24

1990-09-18

Hille, Rolf

357 74, 357 80, H01C 2330

Patent

active

049582160

ABSTRACT:
Disclosed is a package for housing semiconductor elements, which comprises an insulating substrate having in the interior thereof a cavity for attaching and housing semiconductor elements and a lid member covering said cavity, wherein the insulating substrate is composed of a mullite sintered body comprising 70 to 95% by weight of mullite and 5 to 30% by weight, as the total content, of silica (SiO.sub.2) and at least one member selected from the group consisting of magnesia (MgO) and calcia (CaO), and SiO.sub.2, MgO and CaO are present in the following composition expressed by % by weight based on the three components:

REFERENCES:
patent: 3927815 (1975-12-01), Mase et al.
patent: 4630095 (1986-12-01), Otsuka et al.

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