Package for housing an optoelectronic assembly

Details Package for housing an optoelectronic assembly Package for housing an optoelectronic assembly

2005-03-01

2005-03-01

Ullah, Akm Enayet (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S147000

Reexamination Certificate

active

06860652

ABSTRACT:
A package for housing an optoelectronic device and an integrated circuit is disclosed. The package includes an insulating base having an upper surface. The optoelectronic device and the integrated circuit are mounted to the upper surface of the insulating base. The package also includes a metal sealing member having a top wall and a bottom wall. The bottom wall of the metal sealing member is attached to the upper surface of the insulating base. The package further includes a metal cover having a rim located at a bottom portion thereof. The rim of the metal cover is adapted to attach to the top wall of the metal sealing member to thereby hermetically seal the metal cover to the insulating base.

REFERENCES:
patent: RE29325 (1977-07-01), Hargis
patent: 4712030 (1987-12-01), Lakin et al.
patent: 4780795 (1988-10-01), Meinel
patent: 4953006 (1990-08-01), Kovats
patent: 5227646 (1993-07-01), Shigeno
patent: 5337396 (1994-08-01), Chen et al.
patent: 5378924 (1995-01-01), Liang
patent: 5537504 (1996-07-01), Cina et al.
patent: 5736783 (1998-04-01), Wein et al.
patent: 6156992 (2000-12-01), Besslein
patent: 6166461 (2000-12-01), Kusase et al.
patent: 6172412 (2001-01-01), Wein et al.
patent: 6186674 (2001-02-01), Basavanhally
patent: 6203212 (2001-03-01), Rosenberg et al.
patent: 6227724 (2001-05-01), Verdiell
patent: 6252762 (2001-06-01), Amatucci
patent: 6252773 (2001-06-01), Werner
patent: 6303893 (2001-10-01), Perks
patent: 6328484 (2001-12-01), Uebbing
patent: 6331992 (2001-12-01), Gilliland et al.
patent: 6354747 (2002-03-01), Irie et al.
patent: 6376268 (2002-04-01), Verdiell
patent: 6388264 (2002-05-01), Pace
patent: 6400566 (2002-06-01), Ootori
patent: 6407357 (2002-06-01), Bellino et al.
patent: 6422766 (2002-07-01), Althaus et al.
patent: 6426591 (2002-07-01), Yanagisawa et al.
patent: 6444297 (2002-09-01), Bischel
patent: 6446873 (2002-09-01), Geryk
patent: 6450699 (2002-09-01), Murali et al.
patent: 6459842 (2002-10-01), Arsenault et al.
patent: 6493861 (2002-12-01), Li et al.
patent: 6495895 (2002-12-01), Peterson et al.
patent: 6501652 (2002-12-01), Katsui
patent: 6506998 (2003-01-01), VanOtteren et al.
patent: 6511236 (2003-01-01), Webjorn et al.
patent: 6512861 (2003-01-01), Chakravorty et al.
patent: 6515251 (2003-02-01), Wind
patent: 20020043551 (2002-04-01), Payer et al.
patent: 20030223709 (2003-12-01), Lake et al.
patent: 20030231671 (2003-12-01), Huang et al.
patent: 20040010910 (2004-01-01), Farrell et al.
patent: 20040012083 (2004-01-01), Farrell et al.
patent: 20040150072 (2004-08-01), Schnitt et al.
Z.F. Zhi et al., “Heat Sink Design Optimization for Optical Transponders,” The 35thInternational Symposium on Microelectronics, Denver, Colorado, Sep. 4-6, 2002, available at http://www.flotherm.com/technical_papers/t315.pdf.
Kayner, “Tolerance considerations for 10 Gbit/s pluggable module EMI solutions and electrical connector engagement,” available at http://www.xpak.org/XPAK%20whitepaper%20-%20Bezel%20EMI%considerations.pdf.
Kayner et al., “Designing a 10 Gbit/s small form factor pluggable transceiver module for PCI applications,” available at http://www.xpak.org/XPAK%20whitepaper%20-%20Designing%20for%PCI%.
Tatum, pp. 21-23, “VCSEL Packaging for Data Communication Transceiver Design”, Fiberoptic Product News, Jun. 2000.

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