Package for housing a semiconductor element

Details Package for housing a semiconductor element Package for housing a semiconductor element

1996-05-23

1998-10-06

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

257433, 257683, 257634, 257788, 257791, H01L 2714, H01L 2312, G02B 2324

Patent

active

058180940

ABSTRACT:
A semiconductor element-housing package which hermetically houses a semiconductor element for protection against moisture in the atmosphere by bonding an insulating substrate and a lid by means of a sealing material, with a moisture absorbent having surface pores 10-100 .ANG. in radius which is mixed in the insulating substrate and/or the sealing material formed of a resin.

REFERENCES:
patent: 4001863 (1977-01-01), Kobayashi et al.
patent: 4302674 (1981-11-01), Adachi et al.
patent: 4410927 (1983-10-01), Butt
patent: 4720424 (1988-01-01), Eickman et al.
patent: 4745470 (1988-05-01), Yabe et al.
patent: 4961106 (1990-10-01), Butt et al.
patent: 5239412 (1993-08-01), Naka et al.
patent: 5244707 (1993-09-01), Shores
patent: 5391915 (1995-02-01), Mukai et al.
patent: 5523608 (1996-01-01), Kitaoka et al.
patent: 5583376 (1996-12-01), Sickler et al.

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