Package for housing a photosemiconductor device

Details Package for housing a photosemiconductor device Package for housing a photosemiconductor device

1996-08-02

1998-04-28

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

257705, 257782, H01L 2306

Patent

active

057448485

ABSTRACT:
A photosemiconductor device-housing package comprising a metal substrate; an insulating support member on the top surface of which a photosemiconductor device is mounted; a metal frame member attached onto the metal substrate so as to surround the insulating support member and having a fixing region through its side face which fixes an optical fiber therein; outer lead terminals fixed in the metal substrate or the metal frame member via insulants; and a metal lid member attached to the top surface of the metal frame member to hermetically seal the photosemiconductor device, wherein the insulating support member is composed of an aluminum nitride-based sinter, the top surface of the insulating support member is coated with a thin-film brazing material, and the photosemiconductor device is fixed onto the insulating support member via the brazing material.

REFERENCES:
patent: 4585300 (1986-04-01), Landis et al.
patent: 5132532 (1992-07-01), Watanabe

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