Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1977-02-10
1978-02-28
Albritton, C. L.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
357 74, H05K 506
Patent
active
040769550
ABSTRACT:
A flat pack or a platform type ceramic-metal package for housing large scale integrated (LSI) circuit wafers or hybrid circuits comprises a rectangular, square or circular, flat ceramic base metallized with a pattern of radial leads from the central portion of the package to its periphery. The leads pass out underneath a ceramic ring frame hermetically sealed to the base. The outside of the ring frame is metallized. Alternatively, flat-headed metal pins may be passed through the base. Hermetically brazed to the frame is a Kovar ring or sleeve. The electronic device is bonded inside the ring frame to the package base. Electrical connections from wafer or hybrid circuit pads to lead pads or pins within the ring frame are made by conventional wire bonding techniques. A ceramic lid with rim and the outer portion of its upper surface metallized is attached to the package by soldering to the Kovar ring.
REFERENCES:
patent: 3302072 (1967-01-01), O'Neil
patent: 3337678 (1967-08-01), Stelmak
patent: 3509430 (1970-04-01), Mroz
patent: 3550766 (1970-12-01), Nixen et al.
patent: 3753054 (1973-08-01), Johnson
patent: 3872583 (1975-03-01), Beall et al.
Albritton C. L.
Hughes Aircraft Company
MacAllister W. H.
Sternfels Lewis B.
Tone D. A.
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