Package for electronic component, lid material for package...

Details Package for electronic component, lid material for package... Package for electronic component, lid material for package...

2005-12-13

2005-12-13

LaVilla, Michael E. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Macroscopically anomalous interface between layers

C428S600000, C428S621000, C428S680000, C438S126000, C174S050500, C174S050510, C257S704000

Reexamination Certificate

active

06974635

ABSTRACT:
A lid material is provided which comprises: a core layer composed of an Fe—Ni alloy or an Fe—Ni—Co alloy; a nickel-based (Ni-based) metal layer press- and diffusion-bonded onto the core layer and composed of a Ni-based metal, such as pure Ni, mainly comprising Ni; and a brazing material layer press-bonded onto the Ni-based metal layer. The Ni-based metal layer has a maximum-to-minimum thickness ratio T1/T2of 1.4 to 15. The lid material is produced by press-bonding a Ni-based metal foil onto a core sheet for formation of the Ni-based metal layer on the core layer, then diffusion-annealing the Ni-based metal layer and the core layer, and press-bonding a brazing material foil onto the Ni-based metal layer with a reduction ratio of 30 to 65%.

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