Package for an integrated circuit having a container with suppor

Details Package for an integrated circuit having a container with suppor Package for an integrated circuit having a container with suppor

1978-07-24

1980-08-19

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 70, 357 74, 357 80, 29588, 29578, 174 52PE, 174 52S, H01L 2328, H01L 2348, H01L 2944

Patent

active

042187010

ABSTRACT:
An integrated circuit package for an electronic timepiece comprising an integrated circuit holder, a circuit board having an aperture therein and an integrated circuit chip is disclosed. The integrated circuit plastic holder comprises a container, a frame surrounding the container, and bars connecting the container with the frame. The container component is inserted into the aperture of the circuit board. The integrated circuit chip is placed in the container component. Electrodes are provided on the chip and circuit board and wire-bonded to complete the electrical circuit and a synthetic resin potting compound introduced into the circuit holder so as to incase the integrated circuit chip, circuit board, and respective electrode connections within the confines of the framework surrounding the container. Thus, the frame acts as a weir for defining the spreading range of the resin.

REFERENCES:
patent: 3568012 (1971-03-01), Ernst
patent: 3570115 (1971-03-01), Barnes
patent: 3622419 (1971-11-01), London
patent: 3745648 (1973-07-01), Wiesner
patent: 3984739 (1976-10-01), Mochizuki et al.
patent: 4143456 (1979-03-01), Inoue
patent: 4143508 (1979-03-01), Ohno
IBM Technical Disclosure Bulletin; Low-Cost, Large-Scale Integration Single Chip Module Package; vol. 18, No. 11, Apr. 1976, by Jawela, pp. 3698-3699.

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