Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate
2006-06-01
2010-02-02
Nguyen, Dao H (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
Reexamination Certificate
active
07656018
ABSTRACT:
A package for an electronic component includes a synthetic package compound. This synthetic package compound includes an upper outer contact on its upper side and a lower outer contact on its lower side, where the upper outer contact is electrically connected to the lower outer contact via a conduction path. The synthetic package compound includes a mixture of a plastic with filler particles. The conduction path is formed from free conducting metallic inclusions. The filler particles are provided with metallorganic compounds or inorganic complex compounds. The inclusions are formed by photolytic decomposition of the metallorganic compounds or inorganic complex compounds.
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Bauer Michael
Pohl Jens
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
Nguyen Dao H
Nguyen Tram H
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