Package for a semiconductor device including a lead shaping asse

Details Package for a semiconductor device including a lead shaping asse Package for a semiconductor device including a lead shaping asse

1994-04-01

1995-03-14

Larson, Lowell A.

Wireworking

Crimping

53122, B21F 4500

Patent

active

053969332

ABSTRACT:
A semiconductor device comprising a semiconductor unit with leads extending therefrom is placed on a bottom packaging tray having a die-shaped upper surface. A top lubricating type film is used over the device 10 and below a punch unit that is used to bend the leads. A process of assembling the semiconductor device on a die type package is disclosed which includes placing the semiconductor device with leads on a packaging tray with upper lead-shaped baring surfaces, placing an anti-friction film sheet over the tray and over the device with its leads extending therefrom, and actuating a punch unit disposed above the film sheet, thereby forming or bending the leads and simultaneously using the die type tray for packaging the semiconductor device.

REFERENCES:
patent: 4330683 (1982-05-01), Parker
patent: 4366342 (1982-12-01), Breedlove
patent: 4977442 (1990-12-01), Suzuki et al.
patent: 5138434 (1992-08-01), Wood et al.

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