Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent
1997-01-02
1999-02-16
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
257782, 257692, 257693, 257698, 174 524, H01L 2302, H02M 7521
Patent
active
058724036
ABSTRACT:
A method of mounting a power semiconductor die on a substrate, a package for the die and a power supply including the package. The die has a first power terminal on a first surface thereof and a second power terminal on an opposing second surface thereof. The method including the steps of: (1) forming an electrically-conductive, mechanical bond between the first surface and a first location on the substrate, the mechanical bond electrically coupling the first power terminal to the substrate and (2) soldering an elongated electrically conductive strap to the second surface and a second location on the substrate, the conductive strap composed of a material having an electrical resistivity at most about 5.0.times.10-.sup.8 ohm-meters (.OMEGA.-m) and forming a low impedance path between the second power terminal and the second location.
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Disclosure entitled: "Interleaved Forward Converter Using Zero-Voltage Resonant Transition Switching for Distributed Power Processing" Authors: c.P. Henze, D.S. Lo and J.H. Mulkern of Unisys Corporation; pp. 1-18.
Disclosure entitled: "High-Frequency Forward ZVS-MRC For a Low-Profile High-Density On-Board Power Supply" Authors: Wojciech A. Tabisz, Richard T. Gean and Fred C. Lee; pp. 21-30.
Bowman Wayne C.
Chen Shiaw-Jong Stee
Lucent Technologies - Inc.
Thomas Tom
Williams Alexander Oscar
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