Package for a magnetic field sensing device

Electricity: measuring and testing – Magnetic – Displacement

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Details

29595, 174 522, 26420717, 324174, 324251, G01R 3306, G01P 3488, H01L 4300

Patent

active

059630280

ABSTRACT:
A magnetic field sensor assembly has a magnet, a semiconductor sensor and a metal leadframe encapsulated in a plastic package to form a semiconductor integrated circuit. A metal leadframe has a die attach pad on which the sensor is secured and an assembly having one or more projections for securing the magnet in close proximity to the sensor. The leadframe is made from a metal having sufficient spring tension so that the assembly having the projections will secure the magnet. The sensor is adjacent to a ferromagnetic object and will detect a change in magnetic field caused by the ferromagnetic object. Only a thin layer of the plastic package covers the sensor thus reducing the distance between the sensor and the ferromagnetic object but still maintaining an air gap between the plastic package and the ferromagnetic object sufficient to allow passage of the ferromagnetic object.

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