Package embedded three dimensional balun

Details Package embedded three dimensional balun Package embedded three dimensional balun

2007-03-29

2009-12-01

Takaoka, Dean O (Department: 2817)

Wave transmission lines and networks

Coupling networks

Balanced to unbalanced circuits

C333S185000

Reexamination Certificate

active

07626472

ABSTRACT:
Methods and apparatus relating to package embedded three dimensional baluns are described. In one embodiment, components of one or more baluns may be embedded in a single semiconductor substrate. Other embodiments are also described.

REFERENCES:
patent: 6603383 (2003-08-01), Gevorgian et al.
patent: 6819200 (2004-11-01), Zhao et al.
patent: 7068124 (2006-06-01), White et al.
patent: 7176776 (2007-02-01), Tantwai et al.
patent: 7256663 (2007-08-01), Yasuda et al.
patent: 2008/0122074 (2008-05-01), Wong et al.

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