Package connector apparatus

Details Package connector apparatus Package connector apparatus

1993-02-16

1994-08-30

Schwartz, Larry I.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

439629, H01R 2370

Patent

active

053422082

ABSTRACT:
A package connector apparatus of the SMT type which eliminates a discontinuous point in characteristic impedance to assure a good high frequency transfer characteristic and is compatible with another package connector apparatus of the through-hole dip type. A printed circuit board has a plurality of wiring patterns formed on each of the opposite first and second faces thereof, and a connector body is mounted on the first face of the printed circuit board with the center thereof displaced to the first face side of the printed circuit board and has first and second faces formed thereon. A plurality of contacts are mounted in a plurality of rows on and extend from the first and second faces of the connector body. The contacts extending from the first face are connected at the other end portions thereof to the wiring patterns on the first face of the printed circuit board while the other contacts extending from the second face of the connector body are connected at the other end portions thereof to the wiring patterns on the second face of the printed circuit board.

REFERENCES:
patent: 4505035 (1985-03-01), Burton et al.
patent: 4676565 (1987-06-01), Reichardt
patent: 4820173 (1989-04-01), Thom et al.
patent: 4871321 (1989-10-01), Johnson
patent: 4992052 (1991-02-01), Verhoeven
patent: 5201662 (1993-04-01), Roche

Affiliated with

Also associated with

Rating

Package connector apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package connector apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package connector apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-26300