Semiconductor device manufacturing: process – Voltage variable capacitance device manufacture
Reexamination Certificate
2008-07-16
2010-11-09
Pham, Thanh V (Department: 2894)
Semiconductor device manufacturing: process
Voltage variable capacitance device manufacture
C361S780000, C257S700000
Reexamination Certificate
active
07829424
ABSTRACT:
The present invention is directed to a method of fabricating an integrated circuit package having decoupling capacitors using a package design conceived for use without decoupling capacitors. The package is implemented with a minimal redesign of the original design and not requiring any redesign of the signal trace pattern. The invention involves replacing top and bottom bond pads with via straps and then covering the top and bottom reference planes with a dielectric layer having conductive vias that electrically connect with the underlying via straps. Planes having the opposite polarity of the underlying reference plane are then formed on the dielectric layer. These planes include an array of bonding pads in registry with the vias. Decoupling capacitors are mounted to the top of the package and electrically connected with the plane on top of the package and the immediately underlying reference plane without the electrical connections to the capacitors passing through the signal planes of the package.
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Barber Ivor
Miller Leah
Thurairajaratnam Aritharan
Beyer Law Group LLP
Henry Caleb
LSI Corporation
Pham Thanh V
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