Package comprising a composite metal body brought into contact w

Details Package comprising a composite metal body brought into contact w Package comprising a composite metal body brought into contact w

1983-09-07

1987-07-14

Sikes, William L.

357 65, 357 67, 357 81, H01L 2302

Patent

active

046806180

ABSTRACT:
In a package comprising a ceramic member so as to accommodate a semiconductor device, a composite metal body which comprises copper and either one of tungsten and molybdenum is brought into contact with the ceramic member. The composite metal body is provided by impregnating molten copper into a porous block of tungsten or molybdenum and changeable in a thermal expansion coefficient and a thermal conductivity by controlling an amount of copper. The composite metal block may be used as a support for supporting the semiconductor device and/or as a heat sink for dissipating heat radiated from the semiconductor device. Preferably, the composite metal body comprises, by weight, 1-30% of copper and 99-70% of tungsten or molybdenum.

REFERENCES:
patent: 3685134 (1972-08-01), Blue
patent: 3829598 (1974-08-01), Darnell
patent: 3928907 (1975-12-01), Chisholm
patent: 4025997 (1977-05-01), Gernitis et al.
patent: 4427993 (1984-01-01), Fichot et al.

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