Package board and method for manufacturing thereof

Details Package board and method for manufacturing thereof Package board and method for manufacturing thereof

2011-03-08

2011-03-08

Hoffberg, Robert J (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S714000, C361S718000, C257S099000, C257S100000, C257S706000, C257S707000, C257S713000, C362S294000, C362S373000, C438S122000

Reexamination Certificate

active

07903410

ABSTRACT:
A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.

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Japanese Office Action issued Oct. 26, 2010 in corresponding Japanese Patent Application 2008-019693.

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