Package assembly with heat dissipating structure

Details Package assembly with heat dissipating structure Package assembly with heat dissipating structure

2008-02-07

2010-06-29

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S719000, C257S706000, C257S707000, C362S373000

Reexamination Certificate

active

07746644

ABSTRACT:
A package assembly with a heat dissipating structure includes a thermal conductive lower metal layer, an electric insulating ceramic layer, a patterned upper metal layer and an electronic component. The electric insulating ceramic layer is disposed on and bonded to the thermal conductive lower metal layer. The patterned upper metal layer is disposed on and bonded to the electric insulating ceramic layer. The patterned upper metal layer is a single-layered metal layer and has an opening from which the electric insulating ceramic layer is exposed. The electronic component is disposed in the opening of the patterned upper metal layer, mounted on the electric insulating ceramic layer through a thermally conductive adhesive or solder, and electrically connected to the patterned upper metal layer.

REFERENCES:
patent: 5698896 (1997-12-01), Komatsu et al.
patent: 6134776 (2000-10-01), Hoffmeyer
patent: 6428189 (2002-08-01), Hochstein
patent: 6670751 (2003-12-01), Song et al.
patent: 6690087 (2004-02-01), Kobayashi et al.
patent: 6860621 (2005-03-01), Bachl et al.
patent: 6874910 (2005-04-01), Sugimoto et al.
patent: 6949772 (2005-09-01), Shimizu et al.
patent: 7217998 (2007-05-01), Tamagawa et al.
patent: 7258808 (2007-08-01), Kwon et al.
patent: 7259457 (2007-08-01), Zhang et al.
patent: 7345322 (2008-03-01), Kikuchi
patent: 7550319 (2009-06-01), Wang et al.
patent: 2006/0018120 (2006-01-01), Linehan et al.

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