Package assembly for semiconductor device

Details Package assembly for semiconductor device Package assembly for semiconductor device

1984-12-27

1987-04-28

Grimley, Arthur T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361401, H01L 2304

Patent

active

046616535

ABSTRACT:
Disclosed herein is a package assembly for a semiconductor device or devices. The package assembly has a ceramic package body and at least one ceramic cover plate. The package body has a circular outer periphery provided with a plurality of projections to be fitted in grooves formed in an inner peripheral surface of a base board, and a plurality of connector terminals on the surface of the body. Also, the package body is formed with a stepped portion or portions in the rear face thereof. The cover plate or plates are sealed to the stepped portion or portions by pastes applied to both the cover plate and the stepped body portion. This ceramic package assembly enables compactness, moisture-proof complete seal and easy mounting thereof.

REFERENCES:
patent: 3480836 (1969-11-01), Aronstein
patent: 3504096 (1970-03-01), Nagel
patent: 3520054 (1970-07-01), Pensack et al.
patent: 3981074 (1976-09-01), Yamamoto et al.
patent: 4417413 (1983-11-01), Hoppe et al.
patent: 4511796 (1985-04-01), Aigo
patent: 4539622 (1985-09-01), Akasaki

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