Package assembly for an electronic component

Details Package assembly for an electronic component Package assembly for an electronic component

1997-11-25

1999-03-30

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361772, 361813, 257692, 257696, H01L 2348

Patent

active

058896589

ABSTRACT:
A package assembly (70) for encapsulating and vertically surface mounting a semiconductor device such as an accelerometer includes a semiconductor device (40), a package (44) enclosing the semiconductor device, and a plurality of leads (16, 18) protruding from the package. The plurality of leads are formed from a common leadframe (10) and an internal portion of a first lead of the plurality of leads is offset from a common plane corresponding to the common leadframe prior to forming any of the plurality of leads. The offset lead increases the rigidity and vibration-resistance of the package assembly.

REFERENCES:
patent: 5019746 (1991-05-01), Merg
patent: 5444294 (1995-08-01), Suzuki
patent: 5659950 (1997-08-01), Adams et al.

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