Package and the method for making the same, and a stacked...

Details Package and the method for making the same, and a stacked... Package and the method for making the same, and a stacked...

2008-08-05

2010-10-12

Geyer, Scott B (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S127000

Reexamination Certificate

active

07811858

ABSTRACT:
A package and the method for making the same, and a stacked package, the method for making the package includes the following steps: (a) providing a carrier having a plurality of platforms; (b) providing a plurality of dice, and disposing the dice on the platforms; (c) performing a reflow process so that the dice are self-aligned on the platforms; (d) forming a molding compound in the gaps between the dice, and (e) performing a cutting process so as to form a plurality of packages. Since the dice are self-aligned on the platforms during the reflow process, a die attach machine with low accuracy can achieve highly accurate placement.

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patent: 2007/0015315 (2007-01-01), Shiraishi et al.
patent: 2008/0023435 (2008-01-01), Wu et al.

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