Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-04-20
1999-05-04
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361707, 361715, 361719, 257706, 257707, 257711, 257713, 257701, H05K 720
Patent
active
059010428
ABSTRACT:
A semiconductor chip is mounted on the central portion of a metal heat radiator. A pair of metal projecting members are provided on the heat radiator externally of the pair of opposed sides of the semiconductor chip to extend therealong beyond both ends of the semiconductor chip. A circuit board is mounted on the side of each of the pair of projecting members opposed to the semiconductor chip. The top surface of the semiconductor chip and the top surface of each of the projecting members are connected to each other by a third bonding wire for grounding.
REFERENCES:
patent: 4876588 (1989-10-01), Miyamoto
patent: 5477083 (1995-12-01), Kawai
patent: 5485037 (1996-01-01), Marrs
patent: 5583377 (1996-12-01), Higgins, III
patent: 5625228 (1997-04-01), Rogren
patent: 5767573 (1998-06-01), Noda et al.
Maeda Masahiro
Morimoto Shigeru
Nakamura Morio
Ota Yorito
Chervinsky Boris L.
Matsushita Electric - Industrial Co., Ltd.
Picard Leo P.
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