Package and method of packaging semiconductor wafers

Details Package and method of packaging semiconductor wafers Package and method of packaging semiconductor wafers

1979-03-02

1980-05-13

James, Andrew J.

357 74, 357 81, 29413, 29588, H01L 2906, H01L 2302, H01L 2312

Patent

active

042031273

ABSTRACT:
A package and a method of packaging semiconductor devices, especially in expanded wafer form. The package is formed by sticking an adhesive backed ring to the plastic sheet upon which the expanded wafer is affixed so that the ring surrounds the wafer. The adhesive backed ring holds the plastic sheet securely and protects the surface of the wafer. The package is completed by covering the wafer with a second protective sheet and vacuum sealing in a plastic bag.

REFERENCES:
patent: 3040489 (1962-06-01), Decosta
patent: 3112850 (1963-12-01), Garibotti
patent: 3396452 (1968-08-01), Sato et al.
patent: 3461537 (1969-08-01), Lotz
patent: 3537169 (1970-11-01), Eigeman
patent: 3537603 (1970-11-01), Willis
patent: 3559855 (1971-02-01), Barnett
patent: 3562058 (1971-02-01), Boyd
patent: 3606035 (1971-09-01), Gantley
patent: 3707760 (1973-01-01), Citrin
patent: 3762973 (1973-10-01), Gabrail

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