Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2005-01-04
2005-01-04
Thomas, Tom (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S737000, C257S778000, C257S738000, C257S701000
Reexamination Certificate
active
06838758
ABSTRACT:
An integrated circuit package for use in flip-chip manufacturing has a surface having a depression for receiving a bumped die. The depression has disposed on its floor a plurality of cage pads. The depression has four walls, at least one of which is indented to form a step. In the flip-chip manufacturing process, a bumped die is positioned within the depression so that the solder bumps line up with the cage pads, and is precisely aligned and held in place by the depression. The die-package combination is then heated in a furnace to reflow the solder bumps, thus forming an integrated circuit. Using the indentation in the depression, underfill material is introduced into the depression. The underfill material flows into the depression and under the die, surrounding the reflowed solder bumps.
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Chu Chris C.
Thomas Tom
LandOfFree
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