Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent
1976-05-05
1977-06-28
Larkins, William D.
Electricity: conductors and insulators
Feedthrough or bushing
Compression
357 70, 357 74, 174 52PE, 29588, 264272, 264135, 357 17, H01L 2328, H01L 2302, H01L 2312
Patent
active
040329631
ABSTRACT:
Method and structure for encapsulating or providing a package for a light emitting semiconductor device in order to prevent package failure due to chemical contaminants. A light emitting semiconductor chip is connected to terminal leads having sharp angular portions. The device and the sharp angular portions are coated with a resilient elastomeric resin material inner core. An outer core comprising an acrylic or polycarbonate plastic material is injection molded over the inner core so as to leave exposed terminal leads for interconnection to electrical substrates such as cards or printed circuit boards.
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Larkins William D.
Motorola Inc.
Munson Gene M.
Stevens Kenneth R.
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