Package and method for a semiconductor radiant energy emitting d

Details Package and method for a semiconductor radiant energy emitting d Package and method for a semiconductor radiant energy emitting d

1975-10-20

1977-07-12

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29576S, 357 30, B01J 1700

Patent

active

040344665

ABSTRACT:
Method and structure for encapsulating or providing a package for a light emitting semiconductor device in order to prevent package failure due to chemical contaminants. A light emitting semiconductor chip is connected to terminal leads having sharp angular portions. The device and the sharp angular portions are coated with a resilient elastomeric resin material inner core. An outer core comprising an acrylic or polycarbonate plastic material is injection molded over the inner core so as to leave exposed terminal leads for interconnection to electrical substrates such as cards or printed circuit boards.

REFERENCES:
patent: 3735483 (1973-05-01), Sheldon
patent: 3742599 (1973-07-01), Desmond
patent: 3820237 (1974-06-01), Effer

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