Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount
Reexamination Certificate
2006-09-11
2009-10-20
Toledo, Fernando L (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With housing mount
C257S680000, C257S731000
Reexamination Certificate
active
07605467
ABSTRACT:
An upper sealing ring and a lower sealing ring are adhered by sealing solder. The width of tip end of sealing projection is narrower than the width of the lower sealing ring. Therefore, the sealing solder is placed on lower sealing ring and on the side surface of upper sealing ring. Further, an upper connection pad and a lower connection pad are adhered by connecting solder. The width of a tip end of a connection projection is narrower than the width of lower connection pad. Therefore, the connecting solder is placed on the lower connection pad and on the side surface of upper connection pad. Thus, a package is provided, which attains satisfactory electrical connection and hermetic seal after solder joint of the upper and lower substrates.
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Alexandros Margomenos, et al. “Ultra-Wideband Three Dimensional Transitions for On-Wafer Packages”, 34thEuropean Microwave Conference, Amsterdam, 2004, pp. 645-648.
Jeremy Muldavin, et al., “Wide-Band Low-Loss MEMS Packaging Technology”, 2005 IEEE MTT-S International Microwave Symposium, vol. 2 of 4, Long Beach, CA, Jun. 12-17, 2005, 9 pages including cover sheets.
Fujii Yoshio
Fukumoto Hiroshi
Ogawa Shinpei
Yokoyama Yoshinori
Mitsubishi Electric Corporation
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Toledo Fernando L
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