Package and electronic apparatus using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount

Reexamination Certificate

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Details

C257S680000, C257S731000

Reexamination Certificate

active

07605467

ABSTRACT:
An upper sealing ring and a lower sealing ring are adhered by sealing solder. The width of tip end of sealing projection is narrower than the width of the lower sealing ring. Therefore, the sealing solder is placed on lower sealing ring and on the side surface of upper sealing ring. Further, an upper connection pad and a lower connection pad are adhered by connecting solder. The width of a tip end of a connection projection is narrower than the width of lower connection pad. Therefore, the connecting solder is placed on the lower connection pad and on the side surface of upper connection pad. Thus, a package is provided, which attains satisfactory electrical connection and hermetic seal after solder joint of the upper and lower substrates.

REFERENCES:
patent: 6303986 (2001-10-01), Shook
patent: 6441481 (2002-08-01), Karpman
patent: 6603183 (2003-08-01), Hoffman
patent: 6696645 (2004-02-01), Margomenos et al.
patent: 6713844 (2004-03-01), Tatsuta et al.
patent: 6762937 (2004-07-01), Kimoto et al.
patent: 6764875 (2004-07-01), Shook
patent: 7125744 (2006-10-01), Takehara et al.
patent: 7378748 (2008-05-01), Shimizu et al.
patent: 2002/0090752 (2002-07-01), Nakanishi
patent: 2004/0232535 (2004-11-01), Tarn
patent: 2005/0212067 (2005-09-01), Duboc et al.
patent: 2004-160654 (2004-06-01), None
patent: 2004-209585 (2004-07-01), None
Alexandros Margomenos, et al. “Ultra-Wideband Three Dimensional Transitions for On-Wafer Packages”, 34thEuropean Microwave Conference, Amsterdam, 2004, pp. 645-648.
Jeremy Muldavin, et al., “Wide-Band Low-Loss MEMS Packaging Technology”, 2005 IEEE MTT-S International Microwave Symposium, vol. 2 of 4, Long Beach, CA, Jun. 12-17, 2005, 9 pages including cover sheets.

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