Package and connector receptacle

Geometrical instruments

Patent

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Details

339 17CF, 357 68, 357 80, H01L 2350

Patent

active

043873880

ABSTRACT:
A connector assembly for connection to a computer backpanel or the like includes a leadless integrated circuit package and a connector receptacle for receiving the leadless package. The leadless package has two insulating layers and outwardly extending conductors formed on each of the two layers. The insulating layers have contact coupling edges, with the contact coupling edge of one layer extending outwardly of the contact coupling edge of the other layer. Rows of contacts in the receptacle make electrical contact with the conductors on the leadless package at the contact coupling edges. In a second embodiment, the connector assembly includes a leadless integrated circuit package having three insulating layers and outwardly extending conductors formed on each of the three layers.

REFERENCES:
patent: 3160455 (1964-12-01), Mason et al.
patent: 3676748 (1972-07-01), Kobayashi et al.
patent: 4018494 (1977-04-01), Scheingold
patent: 4130327 (1978-12-01), Spaulding
patent: 4296456 (1981-10-01), Reid

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