Package and a method of forming a metal matrix component with in

Details Package and a method of forming a metal matrix component with in Package and a method of forming a metal matrix component with in

1995-03-20

1997-09-02

Lin, Kuang Y.

Metal founding

Process

Shaping liquid metal against a forming surface

164 98, B22D 1914

Patent

active

056621574

ABSTRACT:
A method of forming a metal matrix composite. The method comprises the steps of surrounding at least one insert with reinforcement material. Next, there is the step of orienting the insert and reinforcement material within a mold. Then, there is the step of infiltrating the mold with liquid metal such that the reinforcement material around the insert is infiltrated. A package comprising a metal matrix composite formed of reinforcement material infiltrated with metal. The package also comprises an insert supported in the reinforcement material by the metal. An electronic package comprising a first wall and a second wall integrally connected and extending in a continuous manner from the first wall. The first wall and second wall are a metal matrix composite formed of reinforcement material infiltrated with metal. The metal extends continuously from the first wall to the second wall. Additionally, there is an insert disposed in the reinforcement material and supported by the metal. A cooling panel comprised of a first layer of metal sheet. The cooling panel is also comprised of a layer of metal matrix composite formed of woven reinforcement fibers infiltrated with metal in contact with the first layer. Additionally, the cooling panel is comprised of a second layer of metal sheet in contact with the composite layer. The composite layer is disposed between the first layer and the second layer.

REFERENCES:
patent: 4508158 (1985-04-01), Amateau
patent: 4671336 (1987-06-01), Anahara et al.
patent: 5526867 (1996-06-01), Keck et al.

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