2009-11-02
2010-12-07
Bui, Daniel D (Department: 2912)
Design Patent
active
D0628471
CLAIM:
The ornamental design for a package, as shown and described.
REFERENCES:
patent: D225364 (1972-12-01), Antoni
patent: D336216 (1993-06-01), Rohrbeck
patent: D352204 (1994-11-01), Hayes et al.
patent: D368409 (1996-04-01), Schwartz
patent: D483999 (2003-12-01), Beachum et al.
patent: D552487 (2007-10-01), Chou
patent: D555475 (2007-11-01), Enriquez et al.
patent: D609973 (2010-02-01), Shew et al.
patent: 7736580 (2010-06-01), Shew et al.
Drozek Michael A.
Forowycz Roman
Golota George A.
Sanfilippo James J.
Sanfilippo John E.
Bui Daniel D
Clear Lam Packaging, Inc.
Johannes Thomas J
LandOfFree
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