2008-02-25
2008-10-21
Nelson, T. Chase (Department: 2915)
Design Patent
active
D0578885
CLAIM:
The ornamental design for a package, as shown and described.
REFERENCES:
patent: D96584 (1935-08-01), Baronio
patent: 2895245 (1959-07-01), Spangler
patent: D242844 (1976-12-01), Seiferth et al.
patent: D381266 (1997-07-01), Genma
patent: D438016 (2001-02-01), Lim
patent: D456148 (2002-04-01), Giombini
patent: D479993 (2003-09-01), Humphrey
patent: D484040 (2003-12-01), Kinigakis et al.
patent: D516612 (2006-03-01), Munch
patent: D532613 (2006-11-01), Wu
patent: D550568 (2007-09-01), Lau et al.
patent: D553984 (2007-10-01), Berger
patent: D554499 (2007-11-01), Bone et al.
patent: D554500 (2007-11-01), Bone et al.
patent: D554501 (2007-11-01), Bone et al.
patent: D554522 (2007-11-01), Obregon et al.
patent: D556080 (2007-11-01), Day
patent: D556570 (2007-12-01), Snow
patent: D558058 (2007-12-01), Raso
patent: D558554 (2008-01-01), Carbonaro
patent: D566544 (2008-04-01), Gedanke et al.
patent: D566545 (2008-04-01), Bone et al.
patent: D567080 (2008-04-01), Bone et al.
Korean Gazette, Korean Design Registration No. 3000115430000, published Mar. 11, 1976.
Korean Gazette, Korean Design Registration No. 3000119110000, published Mar. 15, 1976.
Korean Gazette, Korean Design Registration No. 3000172010000, published Dec. 22, 1976.
Korean Gazette, Korean Design Registration No. 3000183690000, published Feb. 24, 1977.
Korean Gazette, Korean Design Registration No. 3000597430000, published Dec. 31, 1985.
Korean Gazette, Korean Design Registration No. 3002032430001, registered Nov. 5, 1997.
Japanese Gazette, Japanese Design Registration No. 1174258, published Jun. 3, 2003.
Japanese Gazette, Japanese Design Registration No. 1176957, published Jun. 23, 2003.
Japanese Gazette, Japanese Design Registration No. 1263134, published Feb. 20, 2006.
Japanese Gazette, Japanese Design Registration No. 1307210, published Aug. 6, 2006.
Japanese Gazette, Japanese Design Registration No. 1322747, published Feb. 25, 2008.
Ban Tatsuya
Saeki Aya
Gunze Limited
Lohr Barbara B
Nelson T. Chase
Saidman DesignLaw Group
LandOfFree
Package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3998847