Package

Details Package Package

1986-08-26

1987-11-24

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361417, H02B 100, H05K 720

Patent

active

047093013

ABSTRACT:
A method for forming a package, and corresponding package structure are disclosed. An electronic component is mounted on a substrate via a spacer, and the component is electrically connected to wiring embedded in the substrate. A space is defined in between the component, the spacer, and the substrate by the electrical connecting path. A first silicone material is filled within said defined space, and a second relatively more hardened silicone material is disposed in an area outside of said defined space and covering the electrical connecting path and portions of the upper surface of the substrate. More particularly, some first silicone material may also be disposed outside the defined space, and covered by the second silicone material. The second silicone material is at first in liquid form and of less viscosity than the first silicone material when originally disposed, and is subsequently hardened by either heating or irradiation.

REFERENCES:
patent: 3164749 (1965-01-01), Berge et al.
patent: 3361937 (1968-01-01), Winkler et al.
patent: 3626252 (1971-12-01), Cath
patent: 4326238 (1982-04-01), Takeda et al.
"Non-Hermetic Packaging Techniques for Hybrids"--Jun. 1979--Older et al.

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