Pacitive electrode system for detecting open solder joints in pr

Electricity: measuring and testing – Testing potential in specific environment – Voltage probe

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324688, 324519, 324457, 324530, 3241581, G01R 3102

Patent

active

054205000

ABSTRACT:
Disclosed is a system for testing continuity that determines whether input and output leads of semiconductor components are present and properly soldered to a printed circuit board. The system includes a signal source stimulus which is connected to a wiring trace on the printed circuit board, which is soldered to the lead being tested. A capacitive test probe is placed on top of the component. The stimulus signal is capacitively coupled through the lead of the integrated circuit package being tested to the capacitive test probe, so if a predetermined signal level is detected by the capacitance test probe, the lead is connected to the circuit assembly. As the capacitances involved are small, the capacitive test probe includes an amplifier, a shield or guard and a buffer circuit to reduce stray fields pick up effects.

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