Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Patent
1997-03-10
1998-06-02
Sellers, Robert E.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
4282974, 4283007, 4283011, 4283014, 428901, 525504, 525523, 525524, B32B 1704, B32B 2704, C08L 6302, C08L 6304
Patent
active
057601461
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The invention concerns epoxy resin mixtures for the production of prepregs and composites, as well as the prepregs and composites produced from these epoxy resin mixtures.
Composites based on epoxy resins and inorganic or organic reinforcing materials have become very important in many industrial fields and in everyday life. The reasons therefor are, on the one hand, the relatively simple and safe processing of epoxy resins and, on the other hand, the good mechanical and chemical properties of cured epoxy resin molded materials, which allow adaptation to different applications and advantageous utilization of the properties of all the materials which are part of the composite.
Epoxy resins are advantageously processed into composites via preparation of prepregs. For this purpose inorganic or organic reinforcing materials or embedding components in the form of fibers, non-woven and woven fabrics, or of flat shaped articles are impregnated with the resin. In most cases this is accomplished with a solution of the resin in an easy-to-evaporate or easy-to-volatilize solvent. The prepregs thus obtained must no longer be tacky, but must not yet be hardened after this process, but rather the resin matrix must be in a pre-polymerized state. In addition, the prepregs must have sufficiently long shelf life. Thus, for example, a shelf life of at least three months is required for circuit board manufacturing. When they are further processed into composites, prepregs must also melt on when the temperature is increased and must bond with the reinforcing materials or embedding components as well as with the materials provided for the composite as firmly and permanently as possible under pressure, i.e., the crosslinked epoxy resin matrix must have a high interfacial adhesion to the reinforcing materials, or embedding components, as well as to the materials to be bonded such as metals, ceramics, minerals, and organic materials.
In the cured state, composites are normally expected to have high mechanical strength and thermal stability, as well as chemical resistance, and heat distortion or resistance to aging. For electrotechnical and electronic applications, the requirements also include permanently high electrical insulation capability and, for special applications, a plurality of other requirements. For use as circuit board material, for example, high dimensional stability over a broad temperature range, good adhesion to glass and copper, high surface resistivity, low dielectric loss factor, good machinability (punchability, drillability), low water absorption, and high corrosion resistance are required.
With increasing load and intensive use of the composites, in particular the requirement for heat distortion becomes especially important. This means that the materials must resist high temperatures without deformation or damage of the composite, for example by delamination, during processing and use. Circuit boards, for example, are exposed to temperatures of over 270.degree. C. during flow soldering. Temperatures over 200.degree. C. may also occur temporarily and in a limited area during cutting and drilling. Materials with a high glass transition temperature have advantageous characteristics in this respect. If the glass transition temperature is above the aforementioned values, dimensional stability in the temperature range prevailing during processing is generally ensured and damage such as warping and delamination are mostly avoided. The epoxy resin currently used worldwide for FR4 laminates has a glass transition temperature T.sub.g of only 130.degree. C. after curing. This results, however, in the above-mentioned type of damage and failure during manufacturing. Therefore it has for long been desired to have comparatively easy-to-process and inexpensive materials with a glass transition temperature T.sub.g of over approx. 180.degree. C.
Another requirement that is becoming more and more important is that of flame resistance. In many areas this requirement has first priority due to possibl
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Huber Jurgen
Kapitza Heinrich
Rogler Wolfgang
von Gentzkow Wolfgang
Sellers Robert E.
Siemens Aktiengesellschaft
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