Oxymethylene polymer molding compositions having enhanced resist

Details Oxymethylene polymer molding compositions having enhanced resist Oxymethylene polymer molding compositions having enhanced resist

1986-05-15

1987-05-19

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525411, 525430, 525927, C08G 6000, C08L 7100

Patent

active

046669957

ABSTRACT:
The black speck formation which occurs during the compounding and molding of admixtures of oxymethylene polymers and polyamides having a melting or softening point below that of the oxymethylene polymer can be reduced by adding the polyamide to the oxymethylene polymer as a dispersion of the polyamide in a carrier resin which is inert to the oxymethylene polymer and has a melting or softening point below that of the oxymethylene polymer. The polyamide comprises less than about 50 weight percent of the dispersion.

REFERENCES:
patent: 3306953 (1967-02-01), Fourcade et al.
patent: 3960984 (1976-06-01), Kohan
patent: 4098843 (1978-07-01), Johnson
patent: 4351916 (1982-09-01), Kohan

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