Oxygen-removing pre-process for copper interconnect grown by...

Details Oxygen-removing pre-process for copper interconnect grown by... Oxygen-removing pre-process for copper interconnect grown by...

2005-01-04

2005-01-04

Talbot, Brian K. (Department: 1762)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S123000, C205S085000, C204S192150

Reexamination Certificate

active

06838116

ABSTRACT:
A solvent, such as deionized water, is heated up to boil to remove the oxygen dissolved in the water before preparing the plating solutions for the growth of copper interconnects. The resistance of the copper grown from the EDD solutions having undergone the oxygen-removing process is greatly improved, down to a value very close to copper's ideal value.

REFERENCES:
patent: 4083754 (1978-04-01), Outsuka et al.
patent: 4725339 (1988-02-01), Bindra et al.
patent: 6582580 (2003-06-01), Hongo et al.
patent: 200084 (1999-07-01), None
patent: 115076 (2002-04-01), None
patent: 10104 (1996-04-01), None

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