Oxygen-free copper product and process

Details Oxygen-free copper product and process Oxygen-free copper product and process

1975-07-02

1977-11-22

Stallard, W.

Specialized metallurgical processes, compositions for use therei

Processes

Electrothermic processes

75161, 148 115C, 148 32, C22C 905, C22F 108

Patent

active

040594378

ABSTRACT:
An improved copper product and process of making it, wherein oxygen-free copper contains small amounts of manganese above normal impurity levels, and has enhanced grain size control during annealing, high electrical conductivity, and increased ductility as cast or fabricated. By adding approximately 1 to approximately 100 parts per million of manganese, the desired oxygen-free product has a minimum electrical conductivity of 100% I.A.C.S. By adding approximately 1 to approximately 50 parts per million of manganese, the desired oxygen-free product has a minimum electrical conductivity of 101% I.A.C.S. When at least approximately 30 parts per million of manganese are added to the oxygen-free copper, ductility is maximized. The manganese may be added at any convenient stage of producing the oxygen-free copper. The copper after annealing is free of or less subject to roughened surfaces or cracking.

REFERENCES:
patent: 1660220 (1928-02-01), de Golyer
patent: 2003296 (1935-06-01), Jennison et al.
patent: 2003889 (1935-06-01), Jennison et al.

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