Oxygen assisted ohmic contact formation to n-type gallium arseni

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437188, 437189, 437192, H01L 2144

Patent

active

053588991

ABSTRACT:
This invention describes a low resistance contact structure to n-type GaAs and a method for making such a contact structure. The contact structure is formed by depositing successive layers of Ni, Au, Ge, and Ni. A fifth layer is then deposited on the first four layers. The fifth layer is a metallic tungsten oxide. The metallic tungsten oxide is formed by sputtering tungsten onto the 4 layer stack in a low pressure argon plus oxygen atmosphere. The resulting 5 layer stack is then annealed in a rapid thermal anneal (RTA) process. The RTA process heats the stack for 5 seconds at 600 degrees. The resulting structure consists of an intermetallic NiGe compound having a small amount of a AuGa compound dispersed within it and being covered by a metallic tungsten oxide film. The oxygen from the metallic tungsten oxide film acts as a gettering mechanism to create gallium vacancies in the GaAs lattice structure during the RTA process. The oxygen forms a compound with gallium which is sandwiched between the metallic tungsten layer and the NiGe metallurgy. The sheet resistance of the contact metallurgy is low because the metallic tungsten oxide film is substantially thicker than that required to provide oxygen for the gettering process. The contact resistance to the n-type GaAs is low because the oxygen acts in a similar fashion to gold and creates more gallium vacancies in the GaAs. These vacancies are filled with an n-type dopant (Ge), supplied by the contact metallurgy, to create a better ohmic contact. The contact structure is reliable because there is a low gold content in the contact and because the nickel stabilizes the germanium which is not used for filling the gallium vacancies in the GaAs lattice.

REFERENCES:
patent: 4471005 (1984-09-01), Cheng et al.
patent: 4524378 (1985-06-01), Cockrum et al.
patent: 4927782 (1990-05-01), Davey et al.
patent: 5125609 (1992-12-01), DiGiacomo et al.
patent: 5134461 (1992-07-01), Yamakawa et al.
patent: 5179041 (1993-01-01), Yano et al.
patent: 5192994 (1993-03-01), Ibuka et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Oxygen assisted ohmic contact formation to n-type gallium arseni does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Oxygen assisted ohmic contact formation to n-type gallium arseni, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Oxygen assisted ohmic contact formation to n-type gallium arseni will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-135145

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.