Oxygen absorbing resin, oxygen absorbing resin composition...

Details Oxygen absorbing resin, oxygen absorbing resin composition... Oxygen absorbing resin, oxygen absorbing resin composition...

2011-03-22

2011-03-22

Miggins, Michael C (Department: 1782)

Stock material or miscellaneous articles

Hollow or container type article

Polymer or resin containing

C428S035200, C428S035400, C252S188280

Reexamination Certificate

active

07910185

ABSTRACT:
An oxygen absorbing resin comprising a carbon atom bonded to a carbon to carbon double bond group and further bonded to one hydrogen atom, the carbon atom contained in an alicyclic structure, which oxygen absorbing resin having been exposed to radiation. Further, there is provided an oxygen absorbing resin comprising a carbon atom bonded to both of the structure (a) carbon to carbon double bond group and (b) heteroatom-containing functional group or, as a bonding group derived from the functional group, carbon to carbon double bond group or aromatic ring, and further bonded to one or two hydrogen atoms, the carbon atom contained in an alicyclic structure.

REFERENCES:
patent: 6454965 (2002-09-01), Ching et al.
patent: 6527976 (2003-03-01), Cai et al.
patent: 62-001824 (1987-01-01), None
patent: 07-224130 (1995-08-01), None
patent: 8-502306 (1996-03-01), None
patent: 2000-239370 (2000-09-01), None
patent: 2001-039475 (2001-02-01), None
patent: 3183704 (2001-04-01), None
patent: 2003-521552 (2003-07-01), None
patent: 2003-253131 (2003-09-01), None

Affiliated with

Also associated with

Rating

Oxygen absorbing resin, oxygen absorbing resin composition... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Oxygen absorbing resin, oxygen absorbing resin composition..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Oxygen absorbing resin, oxygen absorbing resin composition... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2663064