Oxirane primers for SMC adhesives and bonding method employing s

Stock material or miscellaneous articles – Composite – Of epoxy ether

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Details

156182, 156315, 1563314, 428302, B32B 2538, C09J 504

Patent

active

049160184

ABSTRACT:
A process for preparing novel composite structures by priming the surfaces of two or more substrates (such as SMC panels, etc.) with an effective amount of an epoxy resin prior to adhering said surfaces together with an adhesive (such as a polyurethane adhesive) wherein said structures have improved high temperature (about 400.degree. F.) tolerance is described.

REFERENCES:
patent: 4482604 (1984-11-01), Sonermeyer et al.
patent: 4542070 (1985-09-01), Ohtani et al.

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