Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Patent
1998-10-15
2000-01-04
Wu, David W.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
524154, 524413, C08K 332
Patent
active
060110996
DESCRIPTION:
BRIEF SUMMARY
The present invention relates to thermoplastic molding materials containing amount of a copper compound obtainable by reacting copper(I) salts with phosphine chelate ligands and
The present invention furthermore describes novel phosphorus-sulfur compounds and the use of phosphine chelate ligands in copper compounds for stabilizing thermoplastic molding materials. The present invention furthermore relates to the use of the molding materials for the production of moldings of any type and to the moldings obtainable thereby.
The poor stability of polyamides to thermal oxidation has long been known, but the oxidative degradation of the polyamide surface is not sufficiently inhibited with the stabilizers known to date.
For example, EP-A 463 512 describes stabilizer combinations comprising copper(I) halides, triphenylphosphine and amines for toughened polyamides. The addition of amine antioxidants often causes direct discolorations and discolorations on exposure to heat.
CH-A 472 458 discloses the addition of copper(I) salts and triphenylphosphine, particularly in combination with potassium iodide, as a heat stabilizer to the polyamides. These polyamides nevertheless have unsatisfactory heat stability, which is reflected in the deterioration in the impact strength and in the modulus of elasticity. Apart from this, owing to their solubility in water, the stabilizers frequently form a deposit and hence defects which lead to spots and discolorations.
It is an object of the present invention to provide thermoplastic molding materials which exhibit improved heat stabilization and in addition show less tendency to discoloration.
We have found that this object is achieved by the thermoplastic molding materials defined above.
The copper compounds added for stabilization are obtainable by reacting copper(I) salts with known and novel phosphine chelate ligands. The present invention furthermore relates to phosphorus-sulfur compounds of the formula II which may be used as chelate ligands.
Suitable copper(I) salts are both copper salts of organic acids, for example acetic acid, and those of inorganic acids, such as hydrocyanic acid or thiocyanic acid, preferably those of hydrohalic acids. From the group consisting of the copper halides, ie. copper fluoride, copper chloride, copper bromide and copper iodide, the three last-mentioned are preferred, copper iodide being particularly suitable.
Compounds of the general formula (I) ##STR1## where B.sup.1 is C.sub.1 -C.sub.6 -alkylene, naphthylene, phenylene or benzylene, -C.sub.8 -alkyl, C.sub.5 -C.sub.8 -cycloalkyl or phenyl which is unsubstituted or monosubstituted to penta substituted by C.sub.1 -C.sub.4 -alkyl, -C.sub.8 -alkyl, C.sub.5 -C.sub.8 -cycloalkyl, phenyl which is unsubstituted or substituted by C.sub.1 -C.sub.4 -alkyl, or are each --B.sup.1 --PR.sup.2 R.sup.2, B.sup.2 --SR.sup.5 or B.sup.2 --OR.sup.5, and R.sup.3 und R.sup.4 together are --B.sup.2 --PR.sup.2 --B.sup.3 -- or --B.sup.2 --PR.sup.2 --B.sup.3 --PR.sup.2 --B.sup.4 --, and B.sup.2, B.sup.3 and B.sup.4, independently of one another, are each C.sub.1 -C.sub.6 -alkylene, naphthylene, phenylene or benzylene and
Suitable substituents B.sup.1, B.sup.2, B.sup.3 and B.sup.4, independently of one another, are methylene, ethylene, n-propylene, isopropylene, n-butylene, n-pentylene, n-hexylene, 1,1'- or 2,2'-naphthylene, 1,4-phenylene and para-benzylene.
Suitable substituents R.sup.1, R.sup.2, R.sup.3, R.sup.4 and R.sup.5, independently of one another, are methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl and tert-butyl.
R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are furthermore, for example, pentyl, isopentyl, neopentyl, tert-pentyl, hexyl, 2-methylpentyl, heptyl, octyl, 2-ethylhexyl, isooctyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, 2-, 3- or 4-methylphenyl, 2-, 3- or 4-ethylphenyl, 4-isopropylphenyl, 2,4,6-trimethylphenyl, 2,4-dimethylphenyl or 4-tert-butylphenyl.
Preferred copper compounds are those which are obtained by reaction with phosphine chelate ligands of the general formula (II) ##STR2#
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Comba Peter
Grutke Stefan
Katsichtis Charis
BASF - Aktiengesellschaft
Choi Ling Sui
Wu David W.
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