Oxidation barrier composed of a silicide alloy for a thin film a

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material

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438433, 438473, 438580, 438581, 438582, 438583, 438595, 438767, 438768, 438783, 438785, G02F 117

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active

060636920

ABSTRACT:
A method of fabricating an oxidation barrier for a thin film is provided. The method may include forming a thin film (10) outwardly from a semiconductor substrate (12) and separated from the semiconductor substrate (12) by a primary insulator layer (14). A reactive layer (16) may be formed in-situ adjacent to the thin film (10). An oxidation barrier (20) may be formed by a chemical reaction between the thin film (10) and the reactive layer (16). The oxidation barrier (20) may comprise a silicide alloy that operates to reduce oxidation of the thin film (10).

REFERENCES:
patent: 4433901 (1984-02-01), Takahashi et al.
patent: 5286336 (1994-02-01), Chan et al.

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