Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Patent
1998-12-14
2000-05-16
Abraham, Fetsum
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Grooved and refilled with deposited dielectric material
438433, 438473, 438580, 438581, 438582, 438583, 438595, 438767, 438768, 438783, 438785, G02F 117
Patent
active
060636920
ABSTRACT:
A method of fabricating an oxidation barrier for a thin film is provided. The method may include forming a thin film (10) outwardly from a semiconductor substrate (12) and separated from the semiconductor substrate (12) by a primary insulator layer (14). A reactive layer (16) may be formed in-situ adjacent to the thin film (10). An oxidation barrier (20) may be formed by a chemical reaction between the thin film (10) and the reactive layer (16). The oxidation barrier (20) may comprise a silicide alloy that operates to reduce oxidation of the thin film (10).
REFERENCES:
patent: 4433901 (1984-02-01), Takahashi et al.
patent: 5286336 (1994-02-01), Chan et al.
Lee Wei William
Luttmer Joseph D.
Yang Hong
Abraham Fetsum
Donaldson Richard L.
Hoel Carlton H.
Texas Instruments Incorporated
Valetti Mark A.
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