Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2010-12-16
2011-12-06
Pham, Long (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S106000, C257S660000, C257S686000, C257SE21502, C257SE23114
Reexamination Certificate
active
08071431
ABSTRACT:
According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
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Agarwal Anil K.
Hoang Dinphuoc V.
LoBianco Anthony
Noll Thomas E.
Read Matthew S.
Knobbe Martens Olson & Bear LLP
Pham Long
Skyworks Solutions Inc.
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