Overmolded package body on a substrate

Details Overmolded package body on a substrate Overmolded package body on a substrate

1997-08-29

1999-07-27

Jones, Deborah

Special receptacle or package

Holder for a removable electrical component

For a semiconductor wafer

174 67, 206465, 206467, 206509, 206707, 257730, 257732, B65D 7302, H01L 2304

Patent

active

059275057

ABSTRACT:
Substrates having a wide range of thickness, and intended to be overmolded with a plastic package body, are accommodated in a common mold. The top surface of the substrate is provided with a dam structure, which may be formed as an additional layer on the substrate, and which is preferably in the form of a square ring. A groove (channel) is machined (e.g., by routing) into the surface of the dam structure. The top mold half, having a cavity for forming the package body, is provided with a sealing structure at the periphery of the cavity. The sealing structure has a ridge fitting into the channel of the dam structure. The depth of the groove in the dam structure is readily adjusted to ensure uniform clamping pressure of the top mold half on the substrate, so that liquid molding compound is contained within the cavity and so that undue pressure is not exerted on the substrate.

REFERENCES:
patent: 4907065 (1990-03-01), Sahakian
patent: 5231425 (1993-07-01), Masuda et al.
patent: 5296738 (1994-03-01), Freyman et al.
patent: 5361976 (1994-11-01), Blomfield
patent: 5371408 (1994-12-01), Moulton et al.
patent: 5492223 (1996-02-01), Boardman et al.
patent: 5574314 (1996-11-01), Okada et al.
patent: 5590787 (1997-01-01), Hodges
patent: 5594204 (1997-01-01), Taylor et al.

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