Overmolded electronic assembly with metal seal ring

Electrical connectors – With external conductor or cable embedded in insulative... – Molded connector body

Reexamination Certificate

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Details

C439S736000

Reexamination Certificate

active

07455552

ABSTRACT:
An improved overmolded electronic assembly includes a backplate, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, a metal ring on an outer side of a thermoplastic wall member of the electrical connector, and an overmold body. The metal ring circumscribes external connector pins of the electrical connector, and the overmold body together with the backplate and thermoplastic wall member of the electrical connector sealingly encase the circuit substrate and the circuit device defined on the substrate, with the overmold body having a peripheral edge in adhesive contact with the metal ring. The invention avoids delamination problems associate with similar arrangements which do not incorporate a metal ring.

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patent: 7278862 (2007-10-01), Nagashima et al.

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