Overmolded electronic assembly and overmoldable interface...

Electricity: conductors and insulators – Boxes and housings – With electrical device

Reexamination Certificate

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C361S737000

Reexamination Certificate

active

07390978

ABSTRACT:
An overmolded electronic assembly (900, 1000, 1200) is fabricated from one or more overmoldable interface components (300, 400, 500, 1220, 1750) that may be electrical contacts or electronic components that have physical interfaces, such as speakers or sensors. The overmoldable interface components have a sacrificial end that is cut off from the remainder of the overmoldable interface components after being overmolded in an electronic assembly, providing a sealed cavity into the overmolded electronic assembly.

REFERENCES:
patent: 3938725 (1976-02-01), Hardwick et al.
patent: 5448452 (1995-09-01), Kondo et al.
patent: 5841639 (1998-11-01), Schnoor et al.
patent: 6490171 (2002-12-01), Sievers et al.
patent: 6545583 (2003-04-01), Palmer
patent: 6778401 (2004-08-01), Yu et al.
patent: 6870094 (2005-03-01), Otaki
patent: 6933437 (2005-08-01), Chang
patent: 7066660 (2006-06-01), Ellison

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