Overmolded device with contoured surface

Details Overmolded device with contoured surface Overmolded device with contoured surface

2005-09-27

2005-09-27

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080200, C165S080300, C165S185000, C174S016300, C257S707000, C257S713000, C257S787000, C361S714000, C361S717000, C361S718000, C361S722000

Reexamination Certificate

active

06950305

ABSTRACT:
An electronic device has three dimensional surface features molded into an encapsulant forming an electronic package. The electronic package has improved heat transfer compared to conventional electronic devices. The three dimensional features are designed to be moldable.

REFERENCES:
patent: 5254500 (1993-10-01), AuYeung
patent: 2002/0190396 (2002-12-01), Brand
patent: 40-4256347 (1992-09-01), None
patent: 5-47963 (1993-02-01), None

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