Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2007-03-13
2007-03-13
Desire, Gregory (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C257S797000, C257SE23179, C356S401000, C382S144000, C430S314000, C438S401000
Reexamination Certificate
active
11162028
ABSTRACT:
An overlay vernier pattern for measuring multi-layer overlay alignment accuracy and a method for measuring the same is provided. A distance between a first alignment mark in a first material layer and a second alignment mark in an underlying second material layer is measured, so as to provide an alignment offset between the first material layer and the second material layer in addition, a distance between the second alignment mark in the second material layer and a third alignment mark in a third material layer underlying the second material layer is measured, so as to provide an alignment offset between the second material layer and the third material layer. The second alignment marks can be repeatedly used when measuring the alignment accuracy between the first and the second material layers measuring the alignment accuracy between the second and the third material layers.
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Desire Gregory
Hsu Winston
United Microelectronics Corp.
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