Overlay target and measurement procedure to enable self-correcti

Radiant energy – Means to align or position an object relative to a source or...

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356401, G01B 1100

Patent

active

059230410

ABSTRACT:
Imaging instruments for inspecting products, such as semiconductor chips, are calibrated by providing a reference test structure having features which can be located by optical measurements not subject to tool-induced shift and wafer-induced shift experienced by the imaging instrument, thereby enbabling self correction of the imaging instrument. The reference test structure, which has a plurality of target units formed therein, is first qualified using the optical measurements, and is then used to calibrate the imaging instrument. The optical measurements may be made by a supplementary alternative imaging-sensor means which can be integrated into existing imaging instrument architecture. A series of test structure elements may be fabricated with one component of each being spaced at progressively greater distances from an arbitrary baseline, such that a zero overlay element may be identified by the alternative imaging sensor means.

REFERENCES:
patent: 5017514 (1991-05-01), Nishimoto
patent: 5280437 (1994-01-01), Corliss
patent: 5602492 (1997-02-01), Cresswell et al.
patent: 5617340 (1997-04-01), Cresswell et al.

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